C11000 Copper Strip / Foil / Belt / Ribbon Brass Strip
copper foil
Cu%99.90 C11000 Cu ETP
Min thickness:0.001mm
little order can accept
Specification of red copper strip we supply:
Strip: thick:0.01-3.0mm width:610mm
Plate:thick:0.01-3mm width:610mm
Chemical Content, %
Physical Properties
With the assistance of our advanced technology, we offer quality range of Copper Strips and Plate. Manufactured using finest grade of raw material our array is widely used in numerous industries for excellent finish, corrosion resistance and durability. We even custom design these strips and flats as per client specific requirement.
Application of Copper foil
1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3)PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials
copper foil
Cu%99.90 C11000 Cu ETP
Min thickness:0.001mm
little order can accept
Specification of red copper strip we supply:
Strip: thick:0.01-3.0mm width:610mm
Plate:thick:0.01-3mm width:610mm
Chemical Content, %
| Cu | Bi | Sb | As | Fe | Ni | Pb | S | Zn | ROHS Directive | |||
| Cd | Pb | Hg | Cr | |||||||||
| 99.90 | 0.001 | 0.002 | 0.002 | 0.005 | - | 0.005 | 0.005 | - | ND | ND | ND | ND |
Physical Properties
| Melting Point - Liquidus | 1083ºC |
| Melting Point - Solidus | 1065ºC |
| Density | 8.91 gm/cm3@ 20 ºC |
| Specific Gravity | 8.91 |
| Electrical Resistivity | 1.71 microhm-cm @ 20 ºC |
| Electrical Conductivity** | 0.591 MegaSiemens/cm @ 20 ºC |
| Thermal Conductivity | 391.1 W/m ·oK at 20 C |
| Coefficient of Thermal Expansion | 16.9 ·10-6perºC(20-100 ºC) |
| Coefficient of Thermal Expansion | 17.3 ·10-6perºC(20-200 ºC) |
| Coefficient of Thermal Expansion | 17.6·10-6perºC(20-300 ºC) |
| Specific Heat Capacity | 393.5 J/kg ·oK at 293 K |
| Modulus of Elasticity in Tension | 117000 Mpa |
| Modulus of Rigidity | 44130 Mpa |
With the assistance of our advanced technology, we offer quality range of Copper Strips and Plate. Manufactured using finest grade of raw material our array is widely used in numerous industries for excellent finish, corrosion resistance and durability. We even custom design these strips and flats as per client specific requirement.
| Quality ltems | General Technical Terms | ||||||
| 1/3 OZ/ft 2 (12μ m) | 1/2 OZ/ft 2 (18μ m) | 3/4OZ/ft 2 25μ m | 1 OZ/ft 2 35μ m | 7/5 OZ/ft 2 (1.4μ m) | 2 OZ/ft 2 (70μ m) | ||
| Area Weight(g/) | 102-112 | 153 | 230 | 305 | 435 | 610 | |
| Tensile Strenght(kg/mm 2) | STD-E | ≥ 205 | ≥ 205 | ≥ 235 | ≥ 275 | ≥ 275 | ≥ 275 |
| HD-E | ≥ 17 | ≥ 103 | ≥ 156 | ≥ 205 | ≥ 205 | ≥ 205 | |
| Elongation(%) | STD-E | ≥ 2 | ≥ 205 | ≥ 3 | ≥ 3 | ≥ 3 | ≥ 3 |
| HD-E | ≥ 2 | ≥ 2.5 | ≥ 3 | ≥ 3 | ≥ 5 | ≥ 5 | |
| Surface Roughness(μ m) | Shiny Surface Ra | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 |
| Matte Surface Rz | 5 | 6 | 10 | 10 | 12 | 12 | |
| Peel Strength(Kg/cm) | ≥ 1.1 | ≥ 1.2 | ≥ 1.8 | ≥ 1.8 | ≥ 2.1 | ≥ 2.1 | |
| Leakage Poins(points/) | ≤ 5 | No | |||||
| High Temperature Anti-Oxidization Performance | Treat in the 200 constant temperature for 60 minutes, there is no oxidation stain | ||||||
Application of Copper foil
1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3)PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials