0.05mm*50mm Pure Copper Foil C11000 C1221 foil for Mobile phone main board
Copper is copper elemental,because its color is purplish red named.Red copper is industrial pure copper with a melting point of 1083ºC, no isomorphic transformation, and a relative density of 8.9, five times that of magnesium. It is about 15% heavier by volume than ordinary steel. Because it has rose red, the surface of the formation of oxidation film after purple, so commonly known as copper, it is a certain amount of oxygen copper, so also known as oxygen-containing copper.
Specifications of c11000 copper foil
1) Grade: c11000,C12200
2) Copper: cu min.99.90%
3) Thickness: 0.005mm -1.2mm
4) Width: max.600mm
5) Coil weight:20T
6) Chemical Composition: Cu >99.90% p:0.015%-0.040%
7) Temper: O, 1/4H, 1/2H, H O : HV100
8) Electric 20°CConductivity: C11000 >97% ,C12200 >80%
Grade and Manufacturing information for thin copper foil
Features for thin copper foil
1) Good viscosity,Cold resistance
2) Mechanical resistance,Moisture resistant
3) High thermal conductivity,Oil & acid resistant
4) Ageing-resistant
5) Flame retardant
6) Easy to tear apart
Applications for thin copper foil
1) Electric and electric springs,switches
2) Lead frames
3) Connectors and oscillation reeds
3) PCB field
4) Communication cable
5) Cable armoring
6) Mobile phone main board
7) Ion battery production lamination with PI film
8) PCB collector (electrode backing) materials
Copper is copper elemental,because its color is purplish red named.Red copper is industrial pure copper with a melting point of 1083ºC, no isomorphic transformation, and a relative density of 8.9, five times that of magnesium. It is about 15% heavier by volume than ordinary steel. Because it has rose red, the surface of the formation of oxidation film after purple, so commonly known as copper, it is a certain amount of oxygen copper, so also known as oxygen-containing copper.
| Chemical Composition % | |||||||||||
| Alloy code | Cu+Ag | Sn | Zn | Pb | Ni | Fe | Sb | S | As | Bi | O |
| C1100 | ≥99.9 | 0.002 | 0.005 | 0.005 | 0.005 | 0.005 | 0.002 | 0.005 | 0.002 | 0.001 | 0.06 |
| C11000 | ≥99.9 | 0.005 | 0.005 | 0.002 | 0.005 | 0.002 | 0.001 | ||||
| C1221 | ≥99.9 | 0.005 | 0.005 | 0.002 | 0.005 | 0.002 | 0.001 | ||||
| T2 | ≥99.9 | 0.005 | 0.005 | 0.002 | 0.005 | 0.002 | 0.001 | ||||
| T3 | ≥99.9 | 0.005 | 0.005 | 0.002 | 0.005 | 0.002 | 0.001 | ||||
| Mechanical properties (minimum) | ||||
| Alloy code | Tensile strength Rm N/mm2 | Yield strength RP0.2N/mm2 | Elongation A5% | Sample size thickness |
| C1100 | 275 | 10 | 5~40 | |
| C11000 | 295 | 65 | 3 | |
| C1221 | 295 | 65 | 3 | |
| T2 | 295 | 65 | 3 | |
| T3 | 295 | 65 | ||
Specifications of c11000 copper foil
1) Grade: c11000,C12200
2) Copper: cu min.99.90%
3) Thickness: 0.005mm -1.2mm
4) Width: max.600mm
5) Coil weight:20T
6) Chemical Composition: Cu >99.90% p:0.015%-0.040%
7) Temper: O, 1/4H, 1/2H, H O : HV100
8) Electric 20°CConductivity: C11000 >97% ,C12200 >80%
Grade and Manufacturing information for thin copper foil
| Chinese Grade | Abroad Similar Brand | ||||
| International | USA | JAPAN | UK | GERMANY | |
| (ISO) | (ASTM) | (JIS) | (BS) | (DIN) | |
| T2 | Cu-ETP | C11000 | C1100 | C101 | R-Cu57 |
| TP2 | Cu-DHP | C12200 | C1220 | C106 | SI-CU |
| Grade | Chinese State | Specification | Tensile Strength | Elongation | Vickers Hardness |
| T2 | M | Thickness: 0.005-1.2mm Width: (Max)600mm Coil Weight:6.5kg/mm | >205 | >30 | - |
| Y4 | 215-275 | >25 | 55-100 | ||
| TP2 | Y2 | 245-345 | >8 | 75-120 |
1) Good viscosity,Cold resistance
2) Mechanical resistance,Moisture resistant
3) High thermal conductivity,Oil & acid resistant
4) Ageing-resistant
5) Flame retardant
6) Easy to tear apart
Applications for thin copper foil
1) Electric and electric springs,switches
2) Lead frames
3) Connectors and oscillation reeds
3) PCB field
4) Communication cable
5) Cable armoring
6) Mobile phone main board
7) Ion battery production lamination with PI film
8) PCB collector (electrode backing) materials
Hiedy Jiang
Ohmalloy Material Co., Ltd
Add: No. 1211, Mudanjiang Road, Baoshan district, Shanghai